Method for analyzing defect data and inspection apparatus and review system

ABSTRACT

The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

CROSS REFERENCE TO RELATED APPLICATION

This application is the second of two concurrently filed continuationapplications of U.S. Ser. No. 11,095,614, filed Apr. 1, 2005, which is acontinuation of U.S. Ser. No. 10/119,018, filed Apr. 10, 2002 (now U.S.Pat. No. 6,876,445), the contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

The present invention relates to a defect data analyzing method foranalyzing defect distribution states from the defect data detected byinspection apparatus in a semiconductor device manufacturing process inwhich circuit patterns are formed on a semiconductor substrate.

In the semiconductor device manufacturing process in which circuitpatterns are formed on a semiconductor substrate (hereafter, referred toas semiconductor substrate production process), pattern defectinspection or foreign matter inspection is executed after each process,and the inspection results are analyzed, in order to improve andstabilize the yield. In other words, the operator observes the detecteddefects on an optical microscope or scanning electron microscope to knowthe kinds of the defects and identify the causes of the defects. Thisoperation is called review. A method for making effective review isdisclosed in JP-A-10-214866. In this method, the region in which defectsare concentrated is recognized as a cluster from the defectdistribution, and a review point is selected on the basis of the areaand shape of the cluster.

Another method for analyzing the inspection result is proposed to try toestimate the cause of defects in apparatus or process from the analysisof defect distribution states. JP-A-6-61314 describes that wafers aregrouped according to the state in which the defect map has clusters, andit is decided if they have similarities to known patterns, therebyidentifying the cause of defects. In addition, U.S. Pat. No. 5,982,920describes that each defect is classified as one of minute cluster,linear cluster, indefinite-form cluster and global type other thancluster, and related to a cause of defect.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a defect data analyzingmethod capable of extracting a relatively high-density region even ifthe detected defects have a low-density distribution.

It is another object of the invention to provide a defect data analyzingmethod capable of fast classifying clusters of high-density regions ofdetected defects at a practical level.

The method described in the above-given JP-A-10-214866 needs tounderstand the cluster and then specify the shape. Therefore, it cannotbe used for the distribution that is so thin that the cluster cannot berecognized. The method disclosed in the above JP-A-6-61314 or U.S. Pat.No. 5,982,920 also similarly requires to recognize the cluster, and thuscannot be used for thin defect distributions. However, in order to earlydetect an abnormal state of apparatus or process, it is necessary to becapable of treating such thin defect distributions.

In addition, according to the method described in the aboveJP-A-6-61314, patterns of an indeterminate form are registered becauseknown patterns to be used for comparison are produced on the basis ofactual wafers. The method in the U.S. Pat. No. 5,982,920 makes clustersof various forms of lines or of indeterminate forms be classified mixedas one type. In either case, when the cause of defect is specified bymanpower, skill is required. For automatic inspection, an enormousamount of data must be accumulated, and as a result the computation timeincreases. Therefore, information that makes the defect causeidentification by manpower easy is required to be fast produced.

In order to achieve the above object, according to the invention, thereis provided a defect data analyzing method for classifying defects, onthe basis of the position coordinates of defects detected by aninspection apparatus, into at least one kind of distribution featurecategory, or any one of repetitive defect, congestion defect, lineardistribution defect, ring/lump distribution defect and random defect.

According to the invention, since a high-density region imagerepresenting a high-density portion of defects is generated on the basisof the position coordinates of defects detected by an inspectionapparatus, the high-density region is not required to recognize ascluster, and a relatively high-density region can be extracted even ifthe distribution is thin. Moreover, according to the invention, sincethe high-density region image is classified into any one of a pluralityof previously registered geometric patterns, the defect distributionstates can be analyzed at a practical level in both computing time andstorage capacity. Since meaning can be previously created in each of theplurality of geometric patterns, the cause of defect in apparatus orprocess can be identified with ease.

Other objects, features and advantages of the invention will becomeapparent from the following description of the embodiments of theinvention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a process flow diagram showing the idea of the defect dataanalyzing method according to the invention.

FIG. 2 is a flowchart showing the procedure of repetitive defectidentification processing.

FIG. 3 shows an example of a closest point Voronoi diagram.

FIGS. 4A and 4B are graphs useful for explaining the principle of Houghtransform.

FIG. 5 is a flowchart of the procedure of identifying lineardistribution defects.

FIGS. 6A˜6F are diagram useful for explaining a method of identifyinglinear distribution defects.

FIG. 7 is a diagram showing the idea of identifying ring/lumpdistribution defects.

FIG. 8 is a flowchart of the procedure for making a high-density regionimage.

FIG. 9 is a diagram to which reference is made in explaining a method ofautomatically producing ring-shaped dictionary patterns.

FIGS. 10A˜10G are diagrams to which reference is made in explaining amethod of automatically producing lump-shaped dictionary patterns.

FIG. 11 is a diagram useful for explaining a method of computing thedegree of coincidence between the high-density region image and each ofthe dictionary pattern images.

FIG. 12 is a diagram useful for explaining a method of computing thedegree of coincidence between the high-density region image and each ofthe dictionary pattern images.

FIG. 13 is a diagram showing a first method for user patternregistration.

FIG. 14 is a diagram showing a second method for user patternregistration.

FIG. 15 is a block diagram of a first construction of the inspectionapparatus according to the invention.

FIG. 16 is a block diagram of a second construction of the inspectionapparatus according to the invention.

FIG. 17 is a front view of a displayed image showing one example of theimage of the defect data analyzed result according to the invention.

FIG. 18 is a block diagram showing an example of the construction of thereview system according to the invention.

DESCRIPTION OF THE EMBODIMENTS

Embodiments of the invention will be described with reference to theaccompanying drawings.

FIG. 1 is a diagram showing the idea of the defect data analyzing methodaccording to the invention.

In the first embodiment of the defect data analyzing method according tothe invention, defect data 102 produced from a semiconductor substrateinspection apparatus 101 includes at least the coordinates of defectposition. Shown at 103 a, 103 b are wafer maps for showing the positionsof defects expressed by a coordinate system with its origin selected asone point from the wafer. The coordinates of defect that the inspectionapparatus produces can be expressed by a coordinate system with itsorigin selected as one point from the wafer or by coordinate systemswith their origins selected from the respective chips of the wafer. Inthe former case, the coordinate values X, Y of defect are used as theyare, but in the latter case it is necessary that the coordinates ofdefect within a chip be converted to be on another coordinate system byusing chip arrangement information and chip size information. Thedefects on the wafer map are respectively classified on the basis of itsdefect distribution into distribution characteristic categories by thediscrimination processing of repetitive defect, congestive defect,linear distribution, ring/line-shaped distribution and extractionprocessing of random defect.

The repetitive defect occurs over a plurality of chips to be atsubstantially the same positions within each chip. Shown at 104 a, 104 bis the repetitive defect as indicated by dots corresponding to those inthe maps 103 a, 103 b. FIG. 2 is a flowchart for the repetitive defectdiscrimination. First, a chip overlap map is generated from the defectposition coordinates so that all defect positions can be expressed bythe coordinates based on the respective origins of chips (S201). Whenthe coordinates of defect positions are expressed by the coordinatesystem covering all the wafer, it is necessary to convert them by use ofchip arrangement and chip size information so that they can be shown onthe coordinate systems having their origins on the respective chips.Then, a closest point Voronoi diagram is produced to determine thedistances between the adjacent defects on the chip overlap map (S202).FIG. 3 shows an example of the closest point Voronoi diagram. Theclosest point Voronoi diagram represents the area of influence of eachcoordinate point. The area of influence of coordinate point P is definedas a set of closest points of P. The influential area is expressed by apolygon surrounding the point P, and called Voronoi region of P. Thecorresponding points of other regions coming contact with the Voronoiregion of P are the points adjacent to P. Defects having a clusterwithin a chip, or having adjacent defects within the same chip with thedistance d between them equal or less than a predetermined threshold d1are excluded not to be processed (S203). The remaining defects forming acluster, i.e., defects with the distance d equal to or less than apredetermined threshold d2 are combined to be a group, and the grouphaving defects of which the number is equal to or less than a specifiedvalue is detected as repetitive defect (S204). The repetitive defect hasits group number attached for each group. The coordinates within chip,the constituent defect number, chip number that characterize the groupare calculated and recorded.

The congestion defect has a very small distance to the adjacent defecton the wafer map, and normally called cluster defect. Shown at 105 a,105 b are congestion defects that correspond to those of the maps 103 a,103 b as indicated by dots. For congestion defect discrimination,defects with the distance equal to or less than a predeterminedthreshold are connected to form a group, and the group having apredetermined number of defects is detected as congestion defect. Aclosest point Voronoi diagram corresponding to the wafer map isgenerated to determine the distances between the adjacent defects, andit is checked if the distance to the adjacent defects is equal to orless than a threshold. Alternatively, the wafer map is partitioned intolattice areas, and it is previously examined which lattice each pointbelongs to. It is possible to check if the distance between the defectsin the same lattice or in the adjacent lattices is equal to or less thana threshold. The congestion defect has its group number attached foreach group, and the gravitation center coordinates, maximum x/ycoordinates, minimum x/y coordinates, area, defect density andconstituent defect number that characterize the group are calculated andrecorded.

The linear distribution defect has a linear distribution of high-densitydefects. The portion surrounded by a square in 106 a, 106 b shows thelinear distribution defect corresponding to that of 103 a, 103 b. Thelinear distribution does not strictly show a straight line, but has acertain width.

The ring/lump distribution is a distribution having a ring-shaped orlump-shaped distribution of high-density defects. The portionssurrounded by the solid line in 107 a, 107 b show the ring/lumpdistribution defect corresponding to those in 103 a, 103 b.

The other type of detect than the above types of defect is extracted asrandom defect. Shown at 108 a, 108 b are the random defects thatcorrespond to those in 103 a, 103 b.

The linear distribution defect identifying method according to theinvention will be described in detail with reference to FIGS. 4A˜6.

Hough transform is often used for linear detection. FIGS. 4A, 4B arediagrams useful for explaining the principle of Hough transform. Asillustrated in FIG. 4A, a straight line on the x-y plane can beexpressed by two parameters of the distance ρ from the origin and angleθ of the perpendicular to the straight line. When a straight linepassing through a point P1 on the x-y plane in FIG. 4A is plotted on aθρ plane in FIG. 4B, the locus becomes a curve passing through points(θ₁, ρ₁), (θ₂, ρ₂) as shown in FIG. 4B. For other points on the x-yplane, curves can be depicted similarly. When a group of points isdistributed as a straight line as in FIG. 4A, the loci of straight linespassing through each point become curves intersecting at the point (θ₂,ρ₂) as shown in FIG. 4B. Therefore, the groups of points on the x-yplane are converted to the loci on the θρ plane, and of the points (θ,ρ) at which those loci, or curves intersect, a maximal point (θ, ρ) atwhich a maximum number of curves intersect is determined so that astraight line corresponding to the maximal point (θ, ρ) can be detected.

Hough transform is also used for the identification of lineardistribution defect according to the invention. FIG. 5 is a flowchart ofthe linear distribution defect discrimination. FIGS. 6A˜6F show anexample of the processing. First, Hough transform is made for defectcoordinates (S501), and a straight line corresponding to the point ofcoordinates (θ, ρ) at which the maximum number of the curves intersect,or the number of ballots cast is the maximum, is detected as a proposedstraight line (S502). FIG. 6B shows an image, after Hough transform, ofwafer map of FIG. 6A. Since the linear distribution has a certain widthas described above, the resolution of (θ, ρ) is made rough. When normalHough transform is performed, however, a problem occurs that, ifcongestion defect is located in two places, a straight line connectingthe two congestion defects is detected. Since the congestion defect canbe considered as being linearly distributed, removal of congestiondefect also could adversely affect the results. To solve this problem,weighting proportional to the distance between the defects or the squareof the distance between the defects is performed at the time of castingballots to (θ, ρ), thus reducing the contribution of the congestiondefects. To this end, it is necessary to previously generate a closestpoint Voronoi diagram for wafer map and calculate the distances betweenthe defects. If the Voronoi diagram is already generated at the time ofcongestion defect discrimination, it may be used. In addition, sincethere is only one defect within the Voronoi region, the reciprocal ofthe area of the Voronoi region can be considered as the local defectdensity at the corresponding coordinates. The reciprocal of the defectdensity, i.e., the Voronoi region area may be used for the aboveweighting.

Then, the width W in ρ-direction is determined of the portions of α% ofthe maximum ballot number of the proposed straight line as shown in FIG.6B (S503). The value α is a predetermined threshold, and W can beconsidered as the width of the proposed straight line. Next, it ischecked if W is equal to or less than the predetermined threshold. If itis larger than the threshold, i.e., if the width is too wide, it isdecided that there is no linear distribution, and the processing ends(S504). If it, is smaller than the threshold, the wafer map is rotatedby −θ, and a dark and light image is generated that shows the density ofthe periphery of the proposed straight line (S505). At this time, thepixel size is made equal to W. The lattices shown in FIG. 6C areassociated with the pixels of the dark and light image. In the figure,however, the lattices are shown rotated θ in place of rotating the wafermap by −θ. The dark and light image is generated so that large pixelvalues are given for lattices of high-density defects and that the smallpixel values are given for the lattices of low-density defects. Forexample, the pixel value is determined in proportion to the number ofdefects within lattice. The same weighting may be made as at the time ofHough transform processing for reducing the contribution of thecongestion defect.

Then, a proper method such as discrimination analysis method is used tobinarize the dark and light image as shown in FIG. 6D, and the presenceor absence of any linear distribution is decided from the binary image(S506). The black sections in FIG. 6D can be considered as candidates oflinear distribution defect. Since the center line is associated with theposition of the proposed line, the decision of the presence or absenceof any linear distribution is performed by digitalizing the length of aproposed line of defects at the center, the continuity or not, thepresence or absence of side distribution lines, and comparing them withspecified thresholds. In the example of FIG. 6D, the square portionsurrounded by the solid line in FIG. 6E can be decided to be a lineardistribution. If there is no linear distribution, the processing ends(S507). If there is any linear distribution, the portion of FIG. 6E isrotated by θ to be aligned with the corresponding portion on the wafermap as shown in FIG. 6F, and the defects within the solid-line squareare detected as a linear distribution defect (S508). The detected lineardistribution defect is removed not to be processed next (S509), and thesteps from S501 are repeated. Each linear distribution detected duringone cycle of the processing is attached with a group number, and theamounts of characteristics such as position, width, angle, length anddefect density are calculated and recorded.

The ring/lump distribution defect identifying method of the inventionwill be described in detail. FIG. 7 is a diagram showing the concept ofthe ring/lump distribution defect identifying method of the invention.In the first step, a binary image having 1's indicating high defectdensity and 0's indicating low defect density is generated on the basisof the coordinates of defects. This image will be hereafter called ahigh-density region image 704. In the next step, a plurality ofgeometrical dictionary pattern images 705 are automatically generatedaccording to the size of the high density region image 704. Next, thedegree of coincidence between the high density region image 704 and eachof the plurality of geometrical dictionary pattern images 705 iscalculated, and in the last step, a pattern image 706 of the highestdegree of coincidence is selected. According to another aspect of theinvention, dictionary patterns 707 are previously registered by the userexcept the automatically generated geometrical dictionary pattern images705, and the pattern image 706 of the highest degree of coincidence isselected from those patterns 705, 707. The pattern image 706 and wafermap 103 are overlapped, and the defects included within the patternportion are detected as a ring/lump distribution defect.

Each step will be described in detail.

A description will be first made of a method for producing the highdensity region image 704 on the basis of the defect positioncoordinates.

FIG. 8 is a flowchart for the generation of high density region image704.

First, a closest point Voronoi diagram for all defect coordinates isgenerated, and the area of the Voronoi region at each point isdetermined (S801). If this calculation is made in the above lineardistribution defect discrimination processing, the calculation resultmay be used. Then, the histogram of the area of the Voronoi region iscalculated (S802). In this case, the defects classified as any type ofrepetitive defect, congestion defect and linear distribution defect arenot included in the calculation of histogram. The highest frequencyvalue is determined from the histogram, and multiplied by apredetermined number (assumed as N), and the square root of themultiplication result is calculated and used as the image size (S803).The image size is determined so that the whole wafer can be fallen justwithin a single image, and a dark and light image is generated with thenumber of defects per pixel being expressed by tint (S804). This imageis generated by incrementing the pixel value at the coordinates of eachdefect with all pixels initially set to 0. At this time, when N is toolarge, the image size becomes small, making it difficult to discriminateshapes, and thus N should be selected to be about 5. If N is too smallcontrary to the above case, the thickness difference between thehigh-density and low-density portions becomes small, making it difficultto discriminate. Next, the image is binarized by use of a predeterminedthreshold (represented by T) to be a binary image of 1's indicating highdensity portion and 0's indicating low density portion (S805). Here, Tand N should be made substantially equal. The obtained image has apattern of a relatively high defect density. Finally this patternundergoes expansion and contraction processing to form the high-densityregion image 704 (S806). Thus, by generating the image using thismethod, a relatively high density region can be extracted with a properimage size set even if the image has a thin distribution. In addition,another method can be considered in which the dark and light image isgenerated in step S804 and binarized in step S805. Each defect isweighted in proportion to the shortest distance to the adjacent defect,the square of the shortest distance or the Voronoi region area, andadded to the pixels at the corresponding positions, thereby generatingthe dark and light image. This image is binarized by use of adiscrimination analysis method.

A description will be made of the method for automatically producing thegeometric dictionary pattern images 705.

The geometric dictionary pattern images 705 are automatically generatedwith the ring pattern and lump pattern separated. The image size isdetermined as with that of high-density region image 704. The pattern isgenerated by using the largest circle to be depicted on the image as areference according to the following method.

The ring patterns are generated by dividing the reference circle equallyin the radius direction to be concentric circles, and combining smallregions resulting from equal fan-shape division of the circles towardthe central angle as shown in FIG. 9. A method of combining the smallregions will be described with reference to FIG. 9 that shows thepatterns resulting from five division in the radius direction and eightdivisions in the central angle direction. The circular rings (of whichthe innermost one is a circle) resulting from the division in the radiusdirection are attached with symbols of a, b, c, d, and e from theoutside, and the eight fan-shaped regions resulting from the division inthe central angle direction are numbered 1˜8 in turn. The sizes ofcomplete circular rings or circle are combined as 15 combinations of a,b, c, d, e, ab, bc, cd, de, abc, bcd, cde, abcd, bcde, abcde. Thesegments of the circular rings, have seven different sizes, orvariations of an eighth, two eighths, three eighths, four eighths, fiveeighths, six eighths and seven eighths. The segments of each equal sizecan be combined as 8 combinations. For example, the segments of twoeighths can have 8 combinations of 12, 23, 34, 45, 56, 67, 78 and 81.The total combinations resulting from these combinations plus onecircular ring, or 57 combinations can be considered. In addition, sincethe above-mentioned 15 combinations can be considered for each one ofthose combinations, a total of 855 patterns can be generated.

The circular rings are not always required to divide as in the radiusdirection and central angle direction. Also, they are not necessary todivide equally. However, equal division is desirable not to prevent theprocessing from being complicated.

The lump-shaped patterns are generated by dividing the reference circleequally in the horizontal direction by elliptical shapes with the longaxis selected as the vertical diameter, dividing equally in the verticaldirection by elliptical shapes with the long axis selected as thehorizontal diameter and combining the resulting small regions. FIG. 10Ashows 8 divisions of the circle in each direction of the horizontal andvertical directions. The total number of combinations of horizontalsizes and positions is 36 since 8 sizes from 1 to 8 and (9-N) positionswhen the size is N can be considered. The total number of combinationsof vertical sizes and positions is the same. Therefore, since thehorizontal and vertical sizes and positions can be freely combined, 1296different patterns can be generated. FIGS. 10B˜10D show examples ofthese patterns generated in this way as indicated by the black areas.The combinations of separate regions and a pattern having a recess asshown in FIG. 10F cannot be generated in this way. It can also beconsidered that a pattern generated in the above way is rotated 45degrees around the center of the reference circle to be anotherlump-shaped pattern. FIG. 10G shows the small regions formed by divisionin this case. Either case or both cases may be used. The number ofdivisions may be other than 8.

By automatically generating the geometrical dictionary pattern images705 in the above way it is possible to suppress the pattern number to apractical level, and thus achieve fast processing.

A description will be made of a method for calculating the degree ofcoincidence between the high-density region image 704 and each ofdictionary pattern images 705 with reference to FIG. 11. Each pixelvalue of high-density region image 704 is compared with that ofdictionary pattern image 705 at the same address. If coincidence isreached, +1 is produced. If coincidence is not reached, −1 is produced.All the pixels are compared similarly. The results of the comparison ofall pixels are added up, and the total is regarded as the degree ofcoincidence. FIG. 11 shows the high-density region image 704 and parts705 a, 705 b of the dictionary pattern image with the pixel value 1indicated by black and 0 by white. Also 708 a and 708 b representmismatched portions of the high-density region image 704 with thedictionary pattern image 705 a, 705 b as indicated by black. In otherwords, the pixel values of the white portions of these images are 1,those of the black portions are −1, and the total of all pixel values isthe degree of coincidence. When compared with image 708 b, the image 708a is found to have a smaller black area, and thus the degree ofcoincidence of the pattern 705 a with the high-density region image 704is higher than the pattern 705 b.

In the above method, the pattern 706 is detected without fail, but inpractice, it should be decided that any pattern is not produced at allwhen the density is very low or when the density difference is small.Therefore, the detected pattern 706 is verified so that the presence andabsence of pattern is decided. A description will be made of a methodfor deciding the presence or absence of pattern and a method foradjusting the sensitivity of pattern detection. In order to decide thepresence or absence of pattern, it is necessary that a dark and lightimage be generated by a weighting method and used when the high-densityregion image 704 is produced. The detected pattern image 706 and thedark and light image are superimposed on each other, and the ratio C ofdecision analysis values of the inside and outside of pattern iscalculated from the pixel values of the dark and light image accordingto the following equation. $\begin{matrix}{{C = \frac{\omega_{p}{\omega_{b}\left( {\mu_{p} - \mu_{b}} \right)}^{2}}{{\omega_{p}\sigma_{p}^{2}} + {\omega_{b}\sigma_{b}^{2}}}}\left\{ \begin{matrix}{\omega_{p},{\omega_{b}\text{:}{numbers}\quad{of}\quad{pixels}\quad{in}\quad{and}\quad{out}\quad{of}\quad{pattern}}} \\{\mu_{p},{\mu_{b}\text{:}{average}\quad{values}\quad{of}\quad{pixel}\quad{values}\quad{of}\quad{dark}\quad{and}}} \\{{light}\quad{image}\quad{in}\quad{and}\quad{out}\quad{of}\quad{pattern}} \\{\sigma_{p},{\sigma_{b}\text{:}{standard}\quad{deviations}\quad{of}\quad{pixel}\quad{values}\quad{of}\quad{dark}}} \\{{and}\quad{light}\quad{image}\quad{in}\quad{and}\quad{out}\quad{of}\quad{pattern}}\end{matrix} \right.} & (1)\end{matrix}$The ratio C is compared with a predetermined threshold. If it is equalto or smaller than the threshold, it is decided that there is nopattern. In addition, if the highest frequency is lower than apredetermined value in the histogram obtained in step S802, it isdecided that there is no pattern without making the followingprocessing. If the former threshold is selected to be small, a patternwith a smaller density difference can be detected. If the latterthreshold is set to be small, a pattern with a smaller defect densitycan be detected. Therefore, if these thresholds are specified by theuser, the user can adjust the sensitivity.

Incidentally, the semiconductor substrate is not always examined for allsurface because of the restriction to the throughput, but it is oftenpartially examined by specifying inspection or no inspection for eachrow of chips. In this case, it is difficult for the pattern detection tobe made by the above ring/lump discrimination method. Another method fordiscriminating ring/lump distributions with the above problem solvedwill be described with reference to FIG. 12. FIG. 12 is a diagramshowing the idea of ring/lump distribution discrimination that can beused for the defect data on the wafer to be partially examined. Whenpartial examination is executed, the wafer map 103 is, for example, asillustrated. The high-density region image 704 is generated, andgeometric dictionary pattern 705 is automatically produced, by the samemethod as above. On the other hand, a region image 709 to be inspectedis generated on the basis of inspection condition information and chipmatrix data. The region image 709 to be inspected and each geometricdictionary pattern 705 are superimposed, and the degree of coincidenceis calculated with the non-inspection region used as a mask. In otherwords, the dictionary pattern image 705 and region image 709 to beinspected of high-density region image 704 are simultaneously scanned,and the following operations are made. The pixel value is 0 for thenon-inspection region. In the case of inspected region, if the pixelvalues of high-density region image 704 and dictionary pattern image 705are matched, +1 is given, and if they are not matched, −1 is given.Those values are added up over all pixels, and the total is regarded asthe degree of coincidence. In this way, the degree of coincidence iscalculated to each dictionary pattern image 705, and the pattern image706 with the highest degree of coincidence is selected. According tothis method, the degree of coincidence to dictionary pattern 705 can becalculated with high precision even in the case of partial inspection,thus making it possible to discriminate ring/lump distribution defects.

The user pattern registration method will be described below.

FIG. 13 is a diagram useful for explaining the user pattern registrationmethod. First, the user designates a wafer map 901 that has patterns tobe wanted to register, and allows it to be displayed on the screen. Thisdesignation may be omitted, and in this case nothing is displayed. Then,one pattern is selected from divided patterns 902 a˜902 c that are usedfor automatic generation of geometric dictionary patterns. Referencenumeral 902 a represents the same as the ring-shaped pattern shown inFIG. 9, and 902 b and 902 c are the same as the lump-shaped patternsshown in FIGS. 10A and 10G, respectively. The selected pattern 902 isdisplayed overlapped on the wafer map 901. The respective small regionsof the selected divided pattern 902 are switched to be selected or notselected by the user's designation, and the selected region is displayedin a different color. The user selects small regions at high-densitypositions or selects those freely, and after the selection the userorders to register. The combination of specified small regions iscompared with the automatically generated pattern. If no one is includedin the automatically generated pattern, a pattern image 903 is stored asthe user's registrated pattern 707. According to this method, if thecombination of selected small regions but not pattern image is encodedand recorded as user's registrated pattern, satisfactory results can beobtained.

FIG. 14 is a diagram to which reference is made in explaining a userpattern registration method different from the above. The userdesignates the wafer map 901 that has patterns to be wanted to register,and allows it to be displayed on the screen. A high-density region 904is generated and displayed by the above-mentioned high-density regionimage generation method. The high-density region 904 is compared withthe automatically generated dictionary pattern and the previouslyregistered user's registered pattern so that the degree of coincidencethereto can be calculated. If the maximum degree of coincidence is equalto or smaller than a predetermined threshold, it is registered as user'sregistered pattern 707. In this case, the user's registered pattern 707can be recorded as image data.

The user pattern registration method may include both types of method oreither one. Also, it may be different from the above one.

In the second embodiment of the defect data analysis method according tothe invention, information associated with the automatically generatedgeometrical dictionary pattern 705 and user's registered pattern 707 isadded in the ring/lump distribution defect discrimination processing,and the pattern image 706 is selected according to the same method as inthe first embodiment.

The information to be added includes pattern position, size, shape,degree of importance, and specified items. The pattern position, sizeand shape of the geometrical dictionary pattern 705 are roughlyclassified according to a constant rule, and default information isadded. The positions of the lump-shaped pattern are grouped into upperright, top, upper left, right, center, left, lower right, bottom andlower left. The sizes thereof are classed as large, medium and small,and the shapes are lump. For example, FIG. 10B shows a lump-shapedpattern of small size on the upper left, FIG. 10C a lump-shaped patternof medium size on the right, and FIG. 10D a lump-shaped pattern of largesize at the center. The ring-shaped pattern is selected to be a fourthof a large-radius ring on the upper right. In this case, even if thering-shaped patter is derived from a lump-shaped patter, it is regardedas a ring-pattern provided that the pattern has only the singleoutermost row. Even if it is derived from a ring-shaped pattern, it isregarded as a lump-shaped pattern provided that it includes theinnermost circle.

Moreover, means is provided for manually grouping the geometricaldictionary pattern 705 and user's registered pattern and collectivelyadding information, and the same information can be added to the patternthat the user decides to be the same. Accordingly, the resolution ofposition and size information can be adjusted. The degree-of-importanceinformation is entered by the user. The specific items to be enteredinclude information directly associated with cause of defect.

The first embodiment of the inspection apparatus having the defect dataanalysis method according to the invention will be described. Hereafter,repetitive defect, congestion defect, linear distribution defect,ring/lump distribution defect and random defect are called distributionfeature category. Known inspection apparatus for semiconductor substrateinclude foreign substance inspection apparatus, optical type patterndefect inspection apparatus and SEM type pattern defect inspectionapparatus. The inspection apparatus according to the invention makesinspection for semiconductor substrate by the same known method aseither one of these inspection apparatus, classifies the obtained defectdata into the distribution feature category by the above method andproduces the category information together with the defect datainformation.

FIG. 15 is a diagram of the construction of the first embodiment of theinspection apparatus according to the invention.

Pattern information adding means 301 adds pattern-related informationsuch as pattern position, size, shape, degree of importance andspecified item to a plurality of automatically generated geometricaldictionary patterns and user's registered dictionary patterns. It has aportion to add default information to the geometrical dictionarypattern, and a portion to manually add information to the geometricaldictionary pattern and user's registered dictionary pattern. Theaddition of pattern information is made offline. The result is at leastonce stored as a pattern information file 311 in storage means 302 suchas hard disk.

The defect data analysis can be executed in both in-line mode andoffline mode.

Inspection means 303 makes wafer inspection by a well known method, andcauses defect data 102 including at least defect position coordinates tobe stored in the storage means 302.

In in-line mode, the inspection means 303 sends notice of inspectioncompletion to defect data analysis means 304 when inspection of eachwafer is finished. The defect data analysis means 304 reads in defectdata 102 of each wafer from the storage means 302. Alternatively, it maybe so constructed as to transmit and receive defect data 102 without theintervention of storage means 302.

In offline mode, the defect data analysis means 304 is ordered to readin defect data 102 of wafer by the operator.

The defect data analysis means 304 classifies defect data intodistribution feature category on the basis of defect positioncoordinates, and adds distribution feature category number andintra-category group number to defect data of each defect. When aring/lump distribution defect is detected, it causes the patterninformation file 311 to be read from the storage means 302, adds patternimage number or pattern information to the defect data of the ring/lumpdistribution defect, and makes it be stored in the storage means 302 asdefect data 102 including the results of both inspection and analysis.In in-line mode, the inspection means 303 is informed of analysiscompletion.

The result of classification to distribution feature category isdisplayed on display means 305. It may be displayed on a wafer map witha different color for each category, or a wafer map may be generated foreach category and displayed as shown in FIG. 1. Also, chip overlap mapsmay be displayed at the same time. In addition, the pattern image 706selected in the ring/lump distribution discrimination is displayed onthe display means 305 together with information associated with thewafer to be inspected and pattern information added to pattern. At thesame time, it is stored as an image file in association with the waferto be inspected. Moreover, when a linear distribution defect isdetected, a rectangle that indicates its position is displayedsuperimposed on the wafer map, and at the same time, information such asposition, width, angle, length and defect density is displayed. Theseinformation are stored in association with the wafer to be inspected.

User pattern registration means 306 generates user's registered patternsaccording to the order by the operator, and causes pattern code orpattern image to be stored in the storage means 302, depending on thedifference in the above method. It is also possible to construct withthe user pattern registration means 306 not provided.

A description will be made of the second embodiment of the inspectionapparatus having the defect data analysis method according to theinvention. The second embodiment inspects the semiconductor substrate bya well known method, makes the classification to distribution featurecategory on the basis of the obtained defect data information by theabove method, makes sampling on the basis of a specified rule for eachcategory, and produces the classification result and sampling resulttogether with defect data.

FIG. 16 shows the construction of the second embodiment of theinspection apparatus according to the invention.

The pattern information adding means 301 adds sampling condition numberin addition to the above information. It manually groups the dictionarypatterns using the same sampling condition, and attaches the samesampling number. When there is no sampling condition corresponding tothe number, sampling condition generation means 307 generates thesampling condition.

The sampling condition generation means 307 generates the samplingcondition for determining a defect for review. It manually generates thesampling conditions associated with the patterns of ring/lumpdistribution defects, and sampling conditions at each of the otherdistribution feature categories, and makes them be stored as a samplingcondition file 312 in the storage means 302. The sampling conditionsare, for example, sampling number, sampling rate and sampling method.The values of sampling number and sampling rate are entered afterselecting either one for the designation. The sampling number isdetermined by the sampling rate to the number of defects within apattern. Sampling manners such as random and defect number order arelisted so that the user can select them. When defect number order isspecified, sampling is made at intervals matched with the sampling rate.

The operations of the inspection means 303 and defect data analysismeans 304 are the same as in the first embodiment.

Sampling means 308, after completion of defect analysis, reads in thesampling condition 312 and the single-wafer defect data 102 withdistribution feature information added from the storage means 302. Thetransmission and reception of defect data 102 may be made without theintervention of the storage means 302. The condition of sampling isdetermined by the distribution feature category of defect data. If thecategory is ring/lump distribution defect, sampling is made by use ofthe condition associated with the added pattern information. If thecategory is the other one, sampling is made by use of the condition ofeach distribution feature category. As the result of the sampling, aflag of review or not is added to the defect data, and the defect data102 including the results of inspection, analysis and sampling is storedin the storage means 302.

The pattern image 706 selected by the defect data analysis means 304 isdisplayed on the display means 305 together with information associatedwith the wafer to be inspected, and the pattern information added topattern. The defect sampled on the wafer map is displayed in a differentcolor or symbol from the other defects. FIG. 17 shows one example of theresult image.

The user pattern registration means 306 is operated in the same way asin the first embodiment, but may be omitted.

A description will be made of a review system having the defect dataanalysis method according to the invention.

FIG. 18 is a diagram of the review system according to the invention.

On a network are connected a foreign substance inspection apparatus 401,an optical type pattern defect inspection apparatus 402, an SEM typepattern defect inspection apparatus 403, a defect data analysisapparatus 404 and a review apparatus 405. Each inspection apparatus401˜403 and the review apparatus 405 are installed within a clean room.The defect data analysis apparatus 404 may be installed anywhere.

The results from the inspection apparatus 401˜403 are produced as a fileof defect data 102 of the same format, and transferred to the defectdata analysis apparatus 404. The defect data analysis apparatus 404 isconstructed as in FIG. 12, but has no inspection means 303. It reads inthe defect data 102 of the wafer to be analyzed in its defects, andmakes classification to distribution feature category and the samplingbased on the classification result. The distribution feature informationand sampling flag are also added to the defect data 102, produced as afile and transferred to the review apparatus 405.

The review apparatus 405 reads in the defect data 102 with the samplingflag added of the wafer to be reviewed, reviews the defect according tothe information and manually or automatically classifies the defect. Asa result of classification, a category number is added to the defectdata 102, and the defect data is produced as a file and transferred tothe defect data analysis apparatus 405. At the same time, the relatedreview image is also transferred. The defect data analysis apparatus 405generates a report and stores it on the basis of the defect distributionpattern of the wafer to be analyzed, and the defect review result. Thecontent of the report includes information of wafer to be inspected, theresult of classification to distribution feature category, and reviewimage. Since distribution feature and defect review image aresimultaneously displayed, the cause can be easily presumed. According touser's request, the detailed information such as estimated rate ofdefect types or other analyzed results by a well known analysis meansmay be given which are calculated from the sampling positioninformation, review result and sampling rate. Any format may be used forthe report, but HTML format is used. The report is uploaded to a dataserver 406 connected via the Internet or intranet so that it can be readfrom an arbitrary terminal 407 that can be connected to the server.

While an example of three kinds of inspection apparatus and one reviewapparatus connected was shown above, at least one inspection apparatusand one review apparatus may be connected. Moreover, a plurality ofvarious inspection apparatus and review apparatus may be provided. Ifeach inspection apparatus has the same construction as in the secondembodiment of the inspection apparatus according to the invention, thefunction of defect data analyzing apparatus can be achieved by any oneof the inspection apparatus, and thus it is not necessary to separatelyprovide the defect data analyzing apparatus.

While the above defect data analyzing method, and the inspectionapparatus or review system having this method are provided tofundamentally process defect data of a single wafer, a plurality ofwafers can be analyzed together as long as the defect distributiondiscrimination but not sampling is tried to make. In this case, firstthe defect position coordinates of a plurality of wafers aresuperimposed, and a high-density region image is generated on the basisof the superimposed defect position coordinates.

It should be further understood by those skilled in the art that theforegoing description has been made on embodiments of the invention andthat various changes and modifications may be made in the inventionwithout departing from the spirit of the invention and the scope of theappended claims.

1. A method of analyzing defect data, comprising: generating a wafer mapusing information of positions of defects detected by an inspectionapparatus; grouping defects on said wafer map based on a distributiondensity of said defects; and classifying said grouped defects into oneof a plurality of defect categories by calculating a degree ofcoincidence between said grouped defects and a plurality of geometricpatterns generated in accordance with a predetermined parameter of animage region of said grouped defects.
 2. A method of analyzing defectdata according to claim 1, wherein said geometric patterns stored in amemory are generated by calculation.
 3. A method of analyzing defectdata according to claim 1, wherein said geometric patterns stored in amemory include a ring pattern and a part of the ring pattern.
 4. Anapparatus for analyzing defect data, comprising: a first processor whichgenerates a wafer map using information of positions of defects detectedby an inspection apparatus; a second processor which groups defects onsaid wafer map by a distribution density of said defects; and a thirdprocessor which classifies said grouped defects into one of a pluralityof defect categories by calculating a degree of coincidence between saidgrouped defects and a plurality of geometric patterns generated inaccordance with a predetermined parameter of an image region of saidgrouped defects.
 5. An apparatus for analyzing defect data according toclaim 4, wherein said geometric patterns stored in a memory aregenerated by calculation in said third processor.
 6. An apparatus foranalyzing defect data according to claim 4, wherein said geometricpatterns stored in a memory include a ring pattern and a part of thering pattern.